NSD16F3T5G
http://onsemi.com
4
PACKAGE DIMENSIONS
SOT?1123
CASE 524AA?01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM MIN NOM MAX
MILLIMETERS
A
0.34 0.37 0.40
b
0.15 0.20 0.25
c
0.07 0.12 0.17
D
0.75 0.80 0.85
E
0.55 0.60 0.65
0.95 1.00 1.05
L
0.05 0.10 0.15
HE
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.002 0.004 0.006
MIN NOM MAX
INCHES
D
E
b
c
A
L
?Y?
?X?
0.08 (0.0032)
XY
HE
0.40
0.30
0.90
DIMENSIONS: MILLIMETERS
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
e
0.35
0.014
b1
0.10 0.15 0.20
0.004 0.006 0.008
b1
e
0.35
0.25
1
2
3
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
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e changes without further notice
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSD16F3/D
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